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uPG2159T5K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature package surface temperature
: 260
or below
IR260
Time at peak temperature
: 10 seconds or less
Time at temperature of 220
or higher
: 60 seconds or less
Preheating time at 120 to 180
Maximum number of reflow processes
: 120 30 seconds
: 3 times
Maximum chlorine content of rosin flux
mass
: 0.2
Wt.
or below
Wave soldering
Peak temperature molten solder temperature
: 260
or below
WS260
Time at peak temperature
: 10 seconds or less
Preheating temperature
package surface temperature
: 120
or below
Maximum number of reflow processes
: 1 time
Maximum chlorine content of rosin flux
mass
: 0.2
Wt.
or below
Partial Heating
Peak temperature pin temperature
: 350
or below
HS350
Soldering time per side of device
: 3 seconds or less
Maximum chlorine content of rosin flux
mass
: 0.2
Wt.
or below
Caution Do not use different soldering methods together
except for partial heating .
8
Preliminary Data Sheet
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